TUF GAMING X570-PLUS (WI-FI) Desktop Motherboard - AMD X570 Chipset - Socket AM4 - ATX

TUF Gaming Alliance

TUF Gaming Alliance is a collaboration between ASUS and trusted PC-component brands to ensure compatibility with a wide range of parts, such as PC Cases, power supplies, CPU coolers, memory kits and more. With more partnerships and components being added regularly, the TUF Gaming Alliance will continue to grow even stronger.

Dr. MOS

The very first time that TUF GAMING's CPU VRM utilizes 12+2 with Dr. MOS power stages that combine high-side and low-side MOSFETs and drivers into a single package, delivering the power and efficiency that AMD's latest processors demand.

PCB Layers Matter

Bottom up from 6 layers of PCB design provides ultra-smooth and ultra-clean power delivery. It is also the savior not only for DRAM O.C. performance but also for thermal result.

Active Chipset Heatsink
Dedicated cooling for unthrottled transfers

With double the bandwidth via PCIe 4.0, the X570 platform poses greater thermal challenges than its X470 predecessor. We have a full package of thermal solution to deal with it.

Superflo bearing fan

The life cycle of PCH fan is up to 60000 hrs., which may be the longest among competitors. All PCH fan of X570 models are using a quality trusted brand - Delta.

Air duct

ALL X570 models quipped air conduct housing to ensure cooling path.

Finned heatsink

ALL PCH Heatsink of X570 models have finned design to enlarge dissipate area.

PCIe Gen 4
ASUS X570 motherboards support PCI Express 4.0.

A new advancement in PCIe standard doubling the bandwidth from 8GT/s to 16GT/s, which is 2X faster than 8GT/s PCIe 3.0, and 3X faster than 5GT/s PCIe 2.0.

Intel® Wireless-AC 9260

The Intel® Wireless-AC 9260 adapter* with integrated Intel wireless solution includes 2X2 802.11ac Wi-Fi and Bluetooth 5, allowing users a more speedy connecting experience.

Realtek Exclusive Ethernet

Experience ultra-fast gaming performance with the ASUS-exclusive Realtek® L8200A Gigabit Ethernet. With performance and stability enhancements, the LAN is optimized for CPU-efficient, low-latency data transfers.

• AMD AM4 Socket: Ready for 2nd and 3rd Gen AMD Ryzen™ processors
• Enhanced Power Solution: 12+2 Dr. MOS power stages, 6-layer PCB, ProCool sockets, military-grade TUF components, and Digi+ VRM for maximum durability
• Comprehensive Cooling: Active chipset heatsink, VRM heatsink, M.2 heatsink, hybrid fan headers and Fan Xpert 4
• Next-Gen Connectivity: Dual PCIe 4.0 M.2 and USB 3.2 Gen 2 Type-A /Type-C
• Gaming Networking: Exclusive Realtek® L8200A Gigabit Ethernet, Intel 2x2 802.11ac Wi-Fi with MU-MIMO support, Bluetooth 5.0, TUF LANGuard and TurboLAN technology